Semiconductor & Module Assembly
As the world becomes more digitalized, one thing is clear, electronic devices are being driven by smaller, thinner, more functional semiconductor components and assemblies. WELDTONE formulates a wide range of semiconductor materials that are cost effective, reliable and successfully used in electronic devices across multiple industries.
WELDTONE die attach adhesives are used in wire bonding and advanced packaging applications, offering superior protection, adhesion and conductivity.
WELDTONE conductive adhesives are used as an alternative to solder for creating electrical interconnects and grounding.
WELDTONE underfills are formulated with cutting-edge technology and state-of-the-art fillers, enabling finer pitch designs.
WELDTONE (EMI) Shielding material protects sensitive electronics from electromagnetic interference and radio-frequency (RF) emitting devices.
WELDTONE active alignment materials are formulated for precise alignment of lenses in camera modules and other optical assemblies.
WELTONE low-temperature UV curing, and dual cure adhesives are ideal for components with sensitivity to high process temperatures.
Semiconductor
Our semiconductor materials support a variety of electronic devices found in today’s digitalized world, from advanced packaging material solutions that support innovations in smartphones to wire bonding die attach materials used in micro electro-mechanical (MEMs) sensors, WELDTONE can customized materials to meet your specific needs.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
| Semiconductor Materials | Die Attach | ECA25108 | Conductive adhesive, designed for high-speed dispensing with standard thermal and electrical performance. |
| ECA15209 | Conductive adhesive with excellent thermal conductivity performance(20W/mK). | ||
| ECA25812 | Sintering conductive adhesive, Super High thermal and electrical conductivity performance, The thermal conductivity could reach up to >90W/mK. | ||
| Underfill | UF21308 | One component, fine particle epoxy underfill for FC-BGA, FC-CSP type applications. Low CTE and good moisture and heat resistance. | |
| UF70817 | One component, no filler epoxy underfill for the COF/COG application. | ||
| UF21860 | One component, fine particle epoxy underfill with High Tg performance, suit for the CoWoS application. | ||
| EMI Shielding | CC05110 | One component electrically conductive coating material for EMI shielding. Low viscosity designed for spray coating processes. | |
| ECA25617 | One component electrically conductive trench fill material for EMI shielding. Designed for jetting processes. | ||
| ECA25632 | One component electrically conductive trench fill material for EMI shielding. Designed for Vacuum Printing processes. |
Compact Camera Modules (CCMs)
WELDTONE offers a comprehensive portfolio of materials for all elements of camera module assembly including fixed focus and auto focus camera modules.
Our low warpage die attach, and active alignment adhesives are ideal for precise image sensor and lens bonding. We also offer reinforcement materials and conductive adhesives that are ideal for CCM printed circuit boards.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
Compact Camera Modules (CCM) | Die Attach | DA21101 | Non-conductive, one component epoxy designed for low shrinkage, low modulus and low warpage applications. |
| DA21101HM | Non-conductive, one component epoxy for Die attach, the High Modulus Version for DA21101. | ||
| Active Alignment | CB11673 | One component designed for active alignment applications. Provide high aspect ratio, good flexibility and good adhesion after UV cure. | |
| Conductive Adhesive | EC023 | One component, electrically conductive heat cure adhesive, designed for low temperature cure and good electrical performance. | |
| Underfill | UF2100 | One component, fine particle filled epoxy designed for capillary underfilling CSPs and BGAs components. |
Optical Communications
Optical telecommunication uses light to carry information. Transceivers, switches and components inside optoelectronics are enabling faster networking bandwidth and data processing for data and telecommunication centers.
WELTONE materials provide precise alignment of optoelectronics and optimal light transmittance with low signal loss capabilities.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
| Optical Communications | Die Attach | ECA25118 | One component, electrically conductive adhesive designed for high-speed dispensing. Excellent electrical and thermal conductivity. |
| Active Alignment | CB21275 | UV dual cure with secondary heat cure epoxy for optoelectronics assembly. Formulated with high Tg and extremely low CTE with good adhesion and ultra low shrinkage to ensure high reliability. | |
| Low Temp | CB1106-1 | One component active alignment adhesive with good adhesion after UV cure. Dual cure adhesive for shadow curing. | |
| Underfill | UF2100 | One component, fine particle filled epoxy designed for capillary underfilling CSPs and BGAs components. |