In order to stay highly competitive globally as well as domestically, we have been focusing on developing our products through our own researches and technologies. Our lines include additives, corrosion inhibitors, cleaners, activators and a catalyst as well as eco-friendly products related to electronic components, such as semi-conductor, PCB, and cellular phones. Also focus on wafer base bumping process, we provide MS-AG80 ( SnAg ) and MS-CP70 ( Cu Pillar ) solution and provide high ASD and high quality material to customer.
MSC Overview:
- Founded 2005
- Historical Basis : Surface-Treatment Chemicals
- 2 Plants in Korea, and 1 Plant in China
- Certified ISO9001, 14001 & OHSAS System
- Focusing R&D : 15% in total head counts Class 1,000
- Max. capa 7-10 tons per month
- Automatically controlling and monitoring in-line process
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MS-AG80(SnAg)
Design Concepts
- Meet to customer CTQs
- No PR damage & crack during plating process
- Bumping uniformity
- No void or improve void performance compare with competitor
- Bumping quality - no bump missing & no abnormal bump shape
- Ag% Control
- 1.8-2.3% regardless of ASD
- Reliability (TC, THB, and HTS)
- Improvement of ASD to increase of productivity
- 8-16 ASD with adjustment of Ag% composition
- Provide TCoO (Total Cost of Ownership) to customer
Comparison Data
Beta site apply to apply comparison
| Item | High speed candidate | |||
| Model | Competitor A | Competitor B | MS-AG80 | |
| PR Leaching | AZ4620 | Pass | Pass | Pass |
| AZP40XT | Pass | Pass | Pass | |
| Optimized plating rate (ASD) | 6um/min (12) | 4um/min (8) | 6um/min (12) | |
| Uniformity after reflow (WID, <5%) | Max. 4.64 | Max. 4.72 | Max. 1.7 | |
| Uniformity after reflow (WIW, <10%) | Max. 7.98 | Max. 14.1 | Max. 4.38 | |
| Ag composition (Max %) | 3.11 | 3.9 | 1.9 | |
| Bump surface after reflow | Good | Wrinkle | Good | |
| Make-up cost ($ / L) | High | High | Low | |
| Material Cost ($ / wafer) | High | High | Low | |
| Process Cost ($ / wafer) | Middle | High | Low | |
►MS-AG80 showed a better position in terms of material quality and cost
MS-CP70 ( Cu Pillar )
Design Concepts
- High deposition rate, more than 10 ASD (range 4-22 ASD)
- Minimize or eliminate micro void during plating process
- Using the purified raw materials to meet an excellent uniformity and RoHS requirement
- Meet to customer CTQs
- WID <5%
- WIW <10%
- Void free interface b/w Solder and Cu Pillar
- Cost attractiveness
Plating Simulation with TSV
Solution | TSV Type | Machine |
Base : 280mL |  |
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| 10ASD | 12ASD | 14ASD | 16ASD | 18ASD |
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►No issue Cu plating at 10-18 ASD
Application for process
« Bumping »
« Cu Pillar »
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Pb-Free Bump | Cu Pillar & u-Pillar | ||
Diameter | 75-150um | Diameter | 20-100um |
Product | MS-AG80 (High ASD Version) MS-AG40 (Low ASD Version) | Product | MS-AG80(SnAg) MS-CP70(Cu) |
